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BGA rework mobile motherboard soldering station DH-5860
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Shenzhen Dinghua Kechuang Technology Co., Ltd.
6 yrs
CN
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Key attributes
Other attributes
Condition
New
Applicable Industries
Machinery Repair Shops, Retail, Repair shop
Showroom Location
None
Place of Origin
Guangdong, China
Warranty
1 Year
Key Selling Points
Low Maintenance Cost
Weight (KG)
38 KG
Type
Soldering Station
Brand Name
Dinghua(BGA Rework Station)
Dimensions
640*630*590mm
Usage
Repair chips
After Warranty Service
Video technical support, Online support, Spare parts
Local Service Location
None
After-sales Service Provided
Free spare parts, Video technical support, Online support
Product name
Dinghua DH-5860 Mobile Phone BGA Rework Station
Level
Manual + Touch screen
PCB size
Max 420*400 mm Min 22*22 mm
Machine type
Superior PCB motherboard repair station
Application
All kinds of BGA chips or motherboard
Positioning
V-shape card slot, PCB holder can be adjustable by X and Y axes
Temperature control
K-type thermocouple closed loop control, independent temperature
Function
reballing, repair motherboards, BGA, laptop chip, mobile phone chip
Heating
3 independent heating zones
Available BGA chip
2*2mm-80*80mm
Certification
CE, ISO
Packaging and delivery
Packaging Details
Strong wooden case +wooden bars+ proof foams and wrapped film
Selling Units:
Single item
Single package size:
75X71X61 cm
Single gross weight:
60.000 kg
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Lead time
Quantity (sets)
1 - 10
11 - 20
> 20
Lead time (days)
7
13
To be negotiated
Customization
Customized logo
Min. order: 5
Customized packaging
Min. order: 5
Graphic customization
Min. order: 5
For more customization details,
message supplier
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Shenzhen Dinghua Kechuang Technology Co., Ltd.
6
Located in CN
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Product descriptions from the supplier
Minimum order quantity: 1 set
$1,499.00
Variations
Total options:
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